0.8mm 8cm BGA Reballing Machine

Specification and Feature:

• High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
• Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
• Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
• High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
• Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter: