WDS-750 Laptop BGA Machine

Specification and Feature:

• Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
• PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
• Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
• Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement

• High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
• Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
• Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
• High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
• Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter: